14PIN BF CERAMIC PKG

14PIN BF CERAMIC PKG
Design and Analysis

* High Frequency Design
* Thermal Management Design
* High Frequency Simulation and Analysis HFSS,MDS
* Thermal Simulation and Analysis

 Process Technologies

* Thin Film Metallization: Au,Ni,Mo,Ti,Pt
* Passive Components lntegration
* Ball Lens Attachment
* hermetic Glass Sealing with High Thermal Comducting Materials
* Feed thru Terminal: Ceramic Or Glass-Sealed

 Material technologies

* Metal Matrix
* CuW,CuMo,Kovar,Stainless,42 FeNi
* Advanced Ceramics

 Application

* Butterfly Type Module
* Semiconductor Optical Amplifier SOA,SLED
* Pump Laser Module
* Butterfly Type Module

 Appearance & Dimension

NO

PART NAME

MATERIAL

1

CASE

KOVAR

2

BASE

Cu-W20

3

PIPE

KOVAR

4

LEAD

KOVAR

5

GLASS

BH-A

6

BRAZING

JIS Bag-8(EQUIVALENT)

14PIN BF GLASS PKG
14PIN BF GLASS PKG
Design and Analysis

* High Frequency Design
* Thermal Management Design
* High Frequency Simulation and Analysis HFSS,MDS
* Thermal Simulation and Analysis

 Process Technologies

* Thin Film Metallization: Au,Ni,Mo,Ti,Pt
* Passive Components lntegration
* Ball Lens Attachment
* hermetic Glass Sealing with High Thermal Comducting Materials
* Feed thru Terminal: Ceramic Or Glass-Sealed

 Material technologies

* Metal Matrix
* CuW,CuMo,Kovar,Stainless,42 FeNi
* Advanced Ceramics

 Application

* Butterfly Type Module
* Semiconductor Optical Amplifier SOA,SLED
* Pump Laser Module
* Butterfly Type Module

 Appearance & Dimension

NO

PART NAME

MATERIAL

1

CASE

KOVAR

2

BASE

Cu-W20

3

PIPE

KOVAR

4

LEAD

KOVAR

5

GLASS

BH-A

6

BRAZING

JIS Bag-8(EQUIVALENT)